The synopsis for this grant opportunity is detailed below, following
this paragraph. This synopsis contains all of the updates to this
document that have been posted as of
02/06/2013
. If
updates have been made to the opportunity synopsis, update information
is provided below the synopsis.
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Description of Modification
The purpose of this amendment is to:
1. Revise/Correct “HEMT “hot spot” flux metric depicted throughout the BAA – primarily in Table 1 and Table 2.
2. Effect administrative/wording revisions.
3. Delete Attachment 1 and replace with a new Attachment 1 (Cost Proposal Checklist).
Document Type:
Modification to Previous
Grants Notice
Funding Opportunity Number:
DARPA-BAA-13-21
Opportunity Category:
Discretionary
Posted Date:
Feb 06, 2013
Creation Date:
Feb 12, 2013
Original Closing Date for Applications:
Mar 22, 2013
Current Closing Date for Applications:
Mar 22, 2013
Archive Date:
Sep 23, 2013
Funding Instrument Type:
Cooperative Agreement
Grant
Other
Procurement Contract
Category of Funding Activity:
Science and Technology and other Research and Development
Category Explanation:
Expected Number of Awards:
Estimated Total Program Funding:
Award Ceiling:
$0
Award Floor:
$0
CFDA Number(s):
12.910
--
Research and Technology Development
Cost Sharing or Matching Requirement:
No
Eligible Applicants
Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled "Additional Information on Eligibility"
Additional Information on Eligibility:
Agency Name
DARPA - Microsystems Technology Office
Description
Amendment 01: The purpose of this amendment is to:
1. Revise/Correct “HEMT “hot spot” flux metric depicted throughout the BAA – primarily in Table 1 and Table 2.
2. Effect administrative/wording revisions.
3. Delete Attachment 1 and replace with a new Attachment 1 (Cost Proposal Checklist).
All changes are highlighted in yellow in the attached conformed DARPA-BAA-13-21 document. Original synopsis below.
ICECool is exploring disruptive thermal technologies that will mitigate thermal limitations on the operation of military electronic systems, while significantly reducing size, weight, and power consumption (SWaP). The specific goal of ICECool Applications is to enhance the performance of RF power amplifiers and embedded computing systems through the application of chip-level heat removal with kW-level heat flux and heat density with thermal control of local submillimeter hot spots, while maintaining these components in their commonly-accepted temperature range by judicious combination of intra- and/or interchip microfluidic cooling and on-chip thermal interconnects.See the full DARPA-BAA-13-21 document attached.
The following files represent the modifications to this synopsis
with the changes noted within the documents. The list of files is
arranged from newest to oldest with the newest file representing the
current synopsis. Changed sections from the previous document are shown
in a light grey background.
